M00013924
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IEC 62769-8 Ed. 1.0 b:2023 Field device integration (FDI®) – Part 8: EDD to OPC-UA Mapping
standard by International Electrotechnical Commission, 04/01/2023
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Availability date: 10/15/2023
This part of IEC 62769 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.